PIC18F26J53-I/SP vs PIC18F27J53-I/SP

This detailed comparison of PIC18F26J53-I/SP and PIC18F27J53-I/SP in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

PIC18F26J53-I/SP

Roving Networks / Microchip Technology

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PIC18F27J53-I/SP

Roving Networks / Microchip Technology

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Specifications Hide identical items

Manufacturer	Roving Networks / Microchip Technology	Roving Networks / Microchip Technology
Package / Case	28-DIP (0.300", 7.62mm)	28-DIP (0.300", 7.62mm)
Description	IC MCU 8BIT 64KB FLASH 28SPDIP	IC MCU 8BIT 128KB FLASH 28SPDIP
In Stock	352	171
Mounting Type	Through Hole	Through Hole
Part Status	Active	Active
Series	PIC® XLP™ 18J	PIC® XLP™ 18J
Package	Tube	Tube
Core Processor	PIC	PIC
Core Size	8-Bit	8-Bit
Speed	48MHz	48MHz
Connectivity	I²C, LINbus, SPI, UART/USART, USB	I²C, LINbus, SPI, UART/USART, USB
Peripherals	Brown-out Detect/Reset, POR, PWM, WDT	Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O	22	22
Program Memory Size	64KB (32K x 16)	128KB (64K x 16)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	3.8K x 8	3.8K x 8
Voltage - Supply (Vcc/Vdd)	2.15V ~ 3.6V	2.15V ~ 3.6V
Data Converters	A/D 10x10b/12b	A/D 10x10b/12b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	28-SPDIP	28-SPDIP