PIC24F08KM101-E/P vs PIC24F08KM101-I/P

This detailed comparison of PIC24F08KM101-E/P and PIC24F08KM101-I/P in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

PIC24F08KM101-E/P

Roving Networks / Microchip Technology

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PIC24F08KM101-I/P

Roving Networks / Microchip Technology

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Specifications Hide identical items

Manufacturer	Roving Networks / Microchip Technology	Roving Networks / Microchip Technology
Package / Case	20-DIP (0.300", 7.62mm)	20-DIP (0.300", 7.62mm)
Description	IC MCU 16BIT 8KB FLASH 20DIP	IC MCU 16BIT 8KB FLASH 20DIP
In Stock	205	241
Mounting Type	Through Hole	Through Hole
Part Status	Obsolete	Active
Series	PIC® XLP™ 24F	PIC® XLP™ 24F
Package	Tube	Tube
Core Processor	PIC	PIC
Core Size	16-Bit	16-Bit
Speed	32MHz	32MHz
Connectivity	I²C, IrDA, LINbus, SPI, UART/USART	I²C, IrDA, LINbus, SPI, UART/USART
Peripherals	Brown-out Detect/Reset, LVD, POR, PWM, WDT	Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number of I/O	18	18
Program Memory Size	8KB (2.75K x 24)	8KB (2.75K x 24)
Program Memory Type	FLASH	FLASH
EEPROM Size	512 x 8	512 x 8
RAM Size	1K x 8	1K x 8
Voltage - Supply (Vcc/Vdd)	1.8V ~ 3.6V	1.8V ~ 3.6V
Data Converters	A/D 16x10b/12b	A/D 16x10b/12b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 125°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	20-PDIP	20-PDIP