PIC24FJ256GB606-I/MR vs PIC24FJ512GB606-I/MR

This detailed comparison of PIC24FJ256GB606-I/MR and PIC24FJ512GB606-I/MR in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

PIC24FJ256GB606-I/MR

Roving Networks / Microchip Technology

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PIC24FJ512GB606-I/MR

Roving Networks / Microchip Technology

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Specifications Hide identical items

Manufacturer	Roving Networks / Microchip Technology	Roving Networks / Microchip Technology
Package / Case	64-VFQFN Exposed Pad	64-VFQFN Exposed Pad
Description	IC MCU 16BIT 256KB FLASH 64QFN	IC MCU 16BIT 512KB FLASH 64QFN
In Stock	343	811
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	PIC® 24F	PIC® 24F
Package	Tube	Tube
Core Processor	PIC	PIC
Core Size	16-Bit	16-Bit
Speed	32MHz	32MHz
Connectivity	I²C, IrDA, LINbus, PMP, SPI, UART/USART, USB OTG	I²C, IrDA, LINbus, PMP, SPI, UART/USART, USB OTG
Peripherals	Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT	Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
Number of I/O	53	53
Program Memory Size	256KB (85.5K x 24)	512KB (170K x 24)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	32K x 8	32K x 8
Voltage - Supply (Vcc/Vdd)	2V ~ 3.6V	2V ~ 3.6V
Data Converters	A/D 16x10b	A/D 16x10b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	64-QFN-EP (9x9)	64-QFN-EP (9x9)