PT7C5002LC-2WF vs DSC557-0333FI1T

This detailed comparison of PT7C5002LC-2WF and DSC557-0333FI1T in the Clock/Timing - Application Specific provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

PT7C5002LC-2WF

PT7C5002LC-2WF

Zetex Semiconductors (Diodes Inc.)

DSC557-0333FI1T

DSC557-0333FI1T

Roving Networks / Microchip Technology

Specifications
Manufacturer Zetex Semiconductors (Diodes Inc.) Roving Networks / Microchip Technology
Package / Case Die 14-VFQFN Exposed Pad
Description XOIC WAFER 2-OUTPUT MEMS PCIE GEN1/2/3/4 CL
In Stock 1 361 145
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series PT7C5002L DSC557-03
Package Tray Tape & Reel (TR)Cut Tape (CT)Digi-Reel®
PLL No Yes
Main Purpose - PCI Express (PCIe)
Input Crystal -
Output CMOS HCSL, LVCMOS, LVDS
Number of Circuits 1 1
Ratio - Input:Output 1:1 1:2
Differential - Input:Output No/No No/Yes
Frequency - Max 100MHz 100MHz
Voltage - Supply 2.7V ~ 5.5V 2.25V ~ 3.6V
Operating Temperature -20°C ~ 80°C -40°C ~ 85°C
Supplier Device Package Wafer 14-QFN (2.5x3.2)
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