R5F52318AGFP#10 vs R5F52318BDFP#30

This detailed comparison of R5F52318AGFP#10 and R5F52318BDFP#30 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

R5F52318AGFP#10

R5F52318AGFP#10

Renesas Electronics America

R5F52318BDFP#30

R5F52318BDFP#30

Renesas Electronics America

Specifications
Manufacturer Renesas Electronics America Renesas Electronics America
Package / Case 100-LQFP 100-LQFP
Description IC MCU 32BIT 512KB FLSH 100LFQFP IC MCU 32BIT 512KB FLSH 100LFQFP
In Stock 5 000 5 000
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series RX200 RX200
Package Tray Tray
Core Processor RXv2 RXv2
Core Size 32-Bit 32-Bit
Speed 54MHz 54MHz
Connectivity CANbus, EBI/EMI, I²C, IrDA, SCI, SD/SDIO, SPI, SSI, USB OTG CANbus, EBI/EMI, I²C, IrDA, SCI, SD/SDIO, SPI, SSI, USB OTG
Peripherals DMA, LVD, POR, PWM, WDT DMA, LVD, POR, PWM, WDT
Number of I/O 79 79
Program Memory Size 512KB (512K x 8) 512KB (512K x 8)
Program Memory Type FLASH FLASH
EEPROM Size 8K x 8 8K x 8
RAM Size 64K x 8 64K x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 5.5V 1.8V ~ 5.5V
Data Converters A/D 24x12b; D/A 2x12b A/D 24x12b; D/A 2x12b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 105°C (TA) -40°C ~ 85°C (TA)
Supplier Device Package 100-LFQFP (14x14) 100-LFQFP (14x14)
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