R5F523W8ADNG#30 vs R5F523W8BDNG#30

This detailed comparison of R5F523W8ADNG#30 and R5F523W8BDNG#30 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

R5F523W8ADNG#30

Renesas Electronics America

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R5F523W8BDNG#30

Renesas Electronics America

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Specifications Hide identical items

Manufacturer	Renesas Electronics America	Renesas Electronics America
Package / Case	56-VFQFN Exposed Pad	56-VFQFN Exposed Pad
Description	IC MCU 32BIT 512KB FLASH 56HVQFN	IC MCU 32BIT 512KB FLASH 56HVQFN
In Stock	213	40
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	RX200	RX23W
Package	Tray	Tray
Core Processor	RXv2	RXv2
Core Size	32-Bit	32-Bit
Speed	54MHz	54MHz
Connectivity	CANbus, I²C, IrDA, SD/SDIO, SPI, SSI, USB OTG	CANbus, I²C, IrDA, SD/SDIO, SPI, SSI, USB OTG
Peripherals	DMA, LVD, POR, PWM, WDT	DMA, LVD, POR, PWM, WDT
Number of I/O	29	29
Program Memory Size	512KB (512K x 8)	512KB (512K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	8K x 8	8K x 8
RAM Size	64K x 8	64K x 8
Voltage - Supply (Vcc/Vdd)	2.7V ~ 3.6V	2.7V ~ 3.6V
Data Converters	A/D 12x12b; D/A 1x12b	A/D 12x12b; D/A 1x12b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	56-HVQFN (7x7)	56-HVQFN (7x7)