R5F56218BDLE#U0 vs R5F56217BDLE#U0

This detailed comparison of R5F56218BDLE#U0 and R5F56217BDLE#U0 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

R5F56218BDLE#U0

Renesas Electronics America

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R5F56217BDLE#U0

Renesas Electronics America

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Specifications Hide identical items

Manufacturer	Renesas Electronics America	Renesas Electronics America
Package / Case	145-TFLGA	145-TFLGA
Description	IC MCU 32BIT 512KB FLSH 145TFLGA	IC MCU 32BIT 384KB FLSH 145TFLGA
In Stock	1 584	2 320
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	RX600	RX600
Package	Tray	Tray
Core Processor	RX	RX
Core Size	32-Bit	32-Bit
Speed	100MHz	100MHz
Connectivity	CANbus, EBI/EMI, I²C, SCI, SPI, USB	CANbus, EBI/EMI, I²C, SCI, SPI, USB
Peripherals	DMA, LVD, POR, PWM, WDT	DMA, LVD, POR, PWM, WDT
Number of I/O	103	103
Program Memory Size	512KB (512K x 8)	384KB (384K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	96K x 8	64K x 8
Voltage - Supply (Vcc/Vdd)	2.7V ~ 3.6V	2.7V ~ 3.6V
Data Converters	A/D 8x10/12b; D/A 2x10b	A/D 8x10/12b; D/A 2x10b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	145-TFLGA (9x9)	145-TFLGA (9x9)