R7F0E016D2DBN#HA1 vs R7F0E017D2DBN#HA1

This detailed comparison of R7F0E016D2DBN#HA1 and R7F0E017D2DBN#HA1 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

R7F0E016D2DBN#HA1

R7F0E016D2DBN#HA1

Renesas Electronics America

R7F0E017D2DBN#HA1

R7F0E017D2DBN#HA1

Renesas Electronics America

Specifications
Manufacturer Renesas Electronics America Renesas Electronics America
Package / Case 156-XFBGA 156-XFBGA
Description IC MCU 32BIT 1.5MB FLSH 156WLBGA IC MCU 32BIT 1.5MB FLSH 156WLBGA
In Stock 6 350 5 000
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series RE01 RE01
Package Tape & Reel (TR) Tape & Reel (TR)
Core Processor ARM® Cortex®-M0+ ARM® Cortex®-M0+
Core Size 32-Bit 32-Bit
Speed 24MHz 24MHz
Connectivity I²C, IrDA, SCI, SPI, UART/USART, USB I²C, IrDA, SCI, SPI, UART/USART, USB
Peripherals DMA, LCD, LVD, POR, PWM, WDT DMA, LCD, LVD, POR, PWM, WDT
Number of I/O 102 102
Program Memory Size 1.5MB (1.5M x 8) 1.5MB (1.5M x 8)
Program Memory Type FLASH FLASH
EEPROM Size - -
RAM Size 256K x 8 256K x 8
Voltage - Supply (Vcc/Vdd) 1.62V ~ 3.6V 1.62V ~ 3.6V
Data Converters A/D 18x14b SAR; D/A 1x12b A/D 18x14b SAR; D/A 1x12b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Supplier Device Package 156-WLBGA (4.47x4.27) 156-WLBGA (4.47x4.27)
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