RAA458100GNP#HC0 vs MCZ33689DEW

This detailed comparison of RAA458100GNP#HC0 and MCZ33689DEW in the PMIC - Power Management - Specialized provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

RAA458100GNP#HC0

RAA458100GNP#HC0

Renesas Electronics America

MCZ33689DEW

MCZ33689DEW

NXP Semiconductors

Specifications
Manufacturer Renesas Electronics America NXP Semiconductors
Package / Case 40-UFQFN Exposed Pad 32-BSSOP (0.295", 7.50mm Width)
Description MSIG- TXIC IC SYSTEM BASIS CHIP LIN 32-SOIC
In Stock 9 000 1 571
Mounting Type Surface Mount Surface Mount
Part Status Active Obsolete
Series - -
Package Tape & Reel (TR) Tube
Applications Power Supplies, Wireless Charging Automotive
Current - Supply 5mA 5mA
Voltage - Supply 4.4V ~ 5.25V 5.5V ~ 18V
Operating Temperature -20°C ~ 60°C (TA) -40°C ~ 125°C
Supplier Device Package 40-HUQFN (5x5) 32-SOIC
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