S1C17F57D00E200 vs S1C17F57D402000

This detailed comparison of S1C17F57D00E200 and S1C17F57D402000 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

S1C17F57D00E200

Epson

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S1C17F57D402000

Epson

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Specifications Hide identical items

Manufacturer	Epson	Epson
Package / Case	Die	Die
Description	IC MCU 16BIT 32KB FLASH DIE	IC MCU 16BIT 32KB FLASH DIE
In Stock	4 120	1 902
Mounting Type	Surface Mount	Surface Mount
Part Status	Obsolete	Obsolete
Series	-	-
Package	Tape & Reel (TR)	Tape & Reel (TR)
Core Processor	S1C17	S1C17
Core Size	16-Bit	16-Bit
Speed	4.2MHz	4.2MHz
Connectivity	I²C, IrDA, SPI, UART/USART	I²C, IrDA, SPI, UART/USART
Peripherals	PWM, WDT	PWM, WDT
Number of I/O	29	29
Program Memory Size	32KB (32K x 8)	32KB (32K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	2K x 8	2K x 8
Voltage - Supply (Vcc/Vdd)	2V ~ 3.6V	2V ~ 3.6V
Data Converters	-	-
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	-	-