S6E1C31D0AGN20000 vs S6E1C32D0AGN20000

This detailed comparison of S6E1C31D0AGN20000 and S6E1C32D0AGN20000 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

S6E1C31D0AGN20000

S6E1C31D0AGN20000

Cypress Semiconductor

S6E1C32D0AGN20000

S6E1C32D0AGN20000

Cypress Semiconductor

Specifications
Manufacturer Cypress Semiconductor Cypress Semiconductor
Package / Case 64-WFQFN Exposed Pad 64-WFQFN Exposed Pad
Description IC MCU 32BIT 64KB FLASH 64QFN IC MCU 32BIT 128KB FLASH 64QFN
In Stock 1 469 1 443
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series FM0+ S6E1C3 FM0+ S6E1C3
Package Tray Tray
Core Processor ARM® Cortex®-M0+ ARM® Cortex®-M0+
Core Size 32-Bit 32-Bit
Speed 40MHz 40MHz
Connectivity CSIO, I²C, LINbus, SmartCard, UART/USART, USB CSIO, I²C, LINbus, SmartCard, UART/USART, USB
Peripherals I²S, LVD, POR, PWM, WDT I²S, LVD, POR, PWM, WDT
Number of I/O 54 54
Program Memory Size 64KB (64K x 8) 128KB (128K x 8)
Program Memory Type FLASH FLASH
EEPROM Size - -
RAM Size 12K x 8 16K x 8
Voltage - Supply (Vcc/Vdd) 1.65V ~ 3.6V 1.65V ~ 3.6V
Data Converters A/D 8x12b A/D 8x12b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 105°C (TA) -40°C ~ 105°C (TA)
Supplier Device Package 64-QFN (9x9) 64-QFN (9x9)
Part Number Manufacturer Description Request For Quote
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