S6E1C32B0AGU1H010 vs S6E1C32B0AGU1H040

This detailed comparison of S6E1C32B0AGU1H010 and S6E1C32B0AGU1H040 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

S6E1C32B0AGU1H010

S6E1C32B0AGU1H010

Cypress Semiconductor

S6E1C32B0AGU1H040

S6E1C32B0AGU1H040

Cypress Semiconductor

Specifications
Manufacturer Cypress Semiconductor Cypress Semiconductor
Package / Case - -
Description IC MCU 32BIT 128KB FLASH 30WLCSP IC MCU 32BIT 128KB FLASH 30WLCSP
In Stock 4 223 1 297
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series FM0+ S6E1C3 FM0+ S6E1C3
Package Tape & Reel (TR) Tape & Reel (TR)
Core Processor ARM® Cortex®-M0+ ARM® Cortex®-M0+
Core Size 32-Bit 32-Bit
Speed 40MHz 40MHz
Connectivity CSIO, I²C, LINbus, UART/USART, USB CSIO, I²C, LINbus, UART/USART, USB
Peripherals LVD, POR, PWM, WDT LVD, POR, PWM, WDT
Number of I/O 24 24
Program Memory Size 128KB (128K x 8) 128KB (128K x 8)
Program Memory Type FLASH FLASH
EEPROM Size - -
RAM Size 16K x 8 16K x 8
Voltage - Supply (Vcc/Vdd) 1.65V ~ 3.6V 1.65V ~ 3.6V
Data Converters A/D 6x12b A/D 6x12b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 105°C (TA) -40°C ~ 105°C (TA)
Supplier Device Package 30-WLCSP 30-WLCSP
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