S6J326CKSPSE20000 vs S6J323CKSPSE20000

This detailed comparison of S6J326CKSPSE20000 and S6J323CKSPSE20000 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

S6J326CKSPSE20000

S6J326CKSPSE20000

Cypress Semiconductor

S6J323CKSPSE20000

S6J323CKSPSE20000

Cypress Semiconductor

Specifications
Manufacturer Cypress Semiconductor Cypress Semiconductor
Package / Case 208-LQFP Exposed Pad 208-LQFP Exposed Pad
Description IC MCU 32BIT 2.0625MB 208TEQFP IC MCU 32BIT 2.0625MB 208TEQFP
In Stock 4 118 2 329
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series Traveo S6J3200 Traveo S6J3200
Package Tray Tray
Core Processor ARM® Cortex®-R5F ARM® Cortex®-R5F
Core Size 32-Bit 32-Bit
Speed 240MHz 240MHz
Connectivity CANbus, CSIO, Ethernet, I²C, LINbus, SPI, UART/USART CANbus, CSIO, Ethernet, I²C, LINbus, SPI, UART/USART
Peripherals DMA, I²S, LVD, POR, PWM, WDT DMA, I²S, LVD, POR, PWM, WDT
Number of I/O 120 120
Program Memory Size 2.0625MB (2.0625M x 8) 2.0625MB (2.0625M x 8)
Program Memory Type FLASH FLASH
EEPROM Size - -
RAM Size 256K x 8 256K x 8
Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V 4.5V ~ 5.5V
Data Converters A/D 46x12b A/D 46x12b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 105°C (TA) -40°C ~ 105°C (TA)
Supplier Device Package 208-TEQFP (28x28) 208-TEQFP (28x28)
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