SAM9X60D6K-I/4GB vs SAM9X60D6KT-I/4GB

This detailed comparison of SAM9X60D6K-I/4GB and SAM9X60D6KT-I/4GB in the Embedded - Microprocessors provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

SAM9X60D6K-I/4GB

SAM9X60D6K-I/4GB

Roving Networks / Microchip Technology

SAM9X60D6KT-I/4GB

SAM9X60D6KT-I/4GB

Roving Networks / Microchip Technology

Specifications
Manufacturer Roving Networks / Microchip Technology Roving Networks / Microchip Technology
Package / Case 196-TFBGA 196-TFBGA
Description IC MPU 64MBIT DDR BGA IC MPU 64MBIT DDR BGA
In Stock 237 2 500
Mounting Type - -
Part Status Active Active
Series SAM9X SAM9X
Package Tray Tape & Reel (TR)Cut Tape (CT)Digi-Reel®
Core Processor ARM926EJ-S ARM926EJ-S
Number of Cores/Bus Width 1 Core, 32-Bit 1 Core, 32-Bit
Speed 600MHz 600MHz
Co-Processors/DSP - -
RAM Controllers SDR, LPDDR, LPSDR, SRAM SDR, LPDDR, LPSDR, SRAM
Graphics Acceleration Yes Yes
Display & Interface Controllers Keyboard, LCD, Touchscreen Keyboard, LCD, Touchscreen
Ethernet 10/100Mbps (2) 10/100Mbps (2)
SATA - -
USB USB 2.0 (5) USB 2.0 (5)
Voltage - I/O 1.8V, 3.3V 1.8V, 3.3V
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Security Features Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins Boot Security, Cryptography, Memory Scrambling, Secure JTAG, Secure Key Storage, Secure RTC, Tamper Pins
Supplier Device Package 196-TFBGA (11x11) 196-TFBGA (11x11)
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