SI53102-A2-GM vs DSC557-0344FI1T

This detailed comparison of SI53102-A2-GM and DSC557-0344FI1T in the Clock/Timing - Application Specific provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

SI53102-A2-GM

SI53102-A2-GM

Silicon Labs

DSC557-0344FI1T

DSC557-0344FI1T

Roving Networks / Microchip Technology

Specifications
Manufacturer Silicon Labs Roving Networks / Microchip Technology
Package / Case 8-WFDFN Exposed Pad 14-VFQFN Exposed Pad
Description IC CLK BUFFER PCIE 1:2 8TDFN MEMS OSC XO 100.0000MHZ HCSL SMD
In Stock 247 547
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series - DSC557-03
Package Strip Tape & Reel (TR)
PLL No Yes
Main Purpose PCI Express (PCIe) PCI Express (PCIe)
Input Clock -
Output Clock HCSL
Number of Circuits 1 1
Ratio - Input:Output 1:2 0:2
Differential - Input:Output Yes/Yes No/Yes
Frequency - Max 100MHz 100MHz
Voltage - Supply 2.25V ~ 3.63V 2.25V ~ 3.6V
Operating Temperature -40°C ~ 85°C -40°C ~ 85°C
Supplier Device Package 8-TDFN (1.4x1.6) -
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