SI53156-A01AGM vs DSC557-0333FI1

This detailed comparison of SI53156-A01AGM and DSC557-0333FI1 in the Clock/Timing - Application Specific provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

SI53156-A01AGM

SI53156-A01AGM

Silicon Labs

DSC557-0333FI1

DSC557-0333FI1

Roving Networks / Microchip Technology

Specifications
Manufacturer Silicon Labs Roving Networks / Microchip Technology
Package / Case 32-WFQFN Exposed Pad 14-VFQFN Exposed Pad
Description IC PCIE BUFFER 100MHZ 1IN 6OUT 2-OUTPUT MEMS PCIE GEN1/2/3/4 CL
In Stock 173 303
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series - DSC557-03
Package Tube Tube
PLL No Yes
Main Purpose PCI Express (PCIe) PCI Express (PCIe)
Input Clock, Crystal -
Output HCSL HCSL, LVCMOS, LVDS
Number of Circuits 1 1
Ratio - Input:Output 1:6 1:2
Differential - Input:Output No/Yes No/Yes
Frequency - Max 100MHz 100MHz
Voltage - Supply 3.135V ~ 3.465V 2.25V ~ 3.6V
Operating Temperature -40°C ~ 85°C -40°C ~ 85°C
Supplier Device Package 32-QFN (5x5) 14-QFN (2.5x3.2)
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