SP5746CHK0AMMJ6R vs SP5746CHK1AMMJ6R

This detailed comparison of SP5746CHK0AMMJ6R and SP5746CHK1AMMJ6R in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

SP5746CHK0AMMJ6R

NXP Semiconductors

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SP5746CHK1AMMJ6R

NXP Semiconductors

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Specifications Hide identical items

Manufacturer	NXP Semiconductors	NXP Semiconductors
Package / Case	256-LBGA	256-LBGA
Description	IC MCU 32BIT 3MB FLSH 256MAPPBGA	IC MCU 32BIT 3MB FLSH 256MAPPBGA
In Stock	3 303	2 500
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	MPC57xx	MPC57xx
Package	Tape & Reel (TR)	Tape & Reel (TR)
Core Processor	e200z2, e200z4	e200z2, e200z4
Core Size	32-Bit Dual-Core	32-Bit Dual-Core
Speed	80MHz/160MHz	80MHz/160MHz
Connectivity	CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG	CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals	DMA, LVD, POR, WDT	DMA, LVD, POR, WDT
Number of I/O	178	178
Program Memory Size	3MB (3M x 8)	3MB (3M x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	512K x 8	512K x 8
Voltage - Supply (Vcc/Vdd)	3V ~ 5.5V	3V ~ 5.5V
Data Converters	A/D 80x10b, 64x12b	A/D 80x10b, 64x12b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 125°C (TA)	-40°C ~ 125°C (TA)
Supplier Device Package	256-MAPPBGA (17x17)	256-MAPPBGA (17x17)