SP5746CHK1AMMJ6R vs SPC5746CK1AMMJ6

This detailed comparison of SP5746CHK1AMMJ6R and SPC5746CK1AMMJ6 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

SP5746CHK1AMMJ6R

SP5746CHK1AMMJ6R

NXP Semiconductors

SPC5746CK1AMMJ6

SPC5746CK1AMMJ6

NXP Semiconductors

Specifications
Manufacturer NXP Semiconductors NXP Semiconductors
Package / Case 256-LBGA 256-LBGA
Description IC MCU 32BIT 3MB FLSH 256MAPPBGA IC MCU 32BIT 3MB FLSH 256MAPPBGA
In Stock 2 500 1 930
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series MPC57xx MPC57xx
Package Tape & Reel (TR) Tray
Core Processor e200z2, e200z4 e200z2, e200z4
Core Size 32-Bit Dual-Core 32-Bit Dual-Core
Speed 80MHz/160MHz 80MHz/160MHz
Connectivity CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals DMA, LVD, POR, WDT DMA, LVD, POR, WDT
Number of I/O 178 178
Program Memory Size 3MB (3M x 8) 3MB (3M x 8)
Program Memory Type FLASH FLASH
EEPROM Size - -
RAM Size 512K x 8 512K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V 3V ~ 5.5V
Data Converters A/D 80x10b, 64x12b A/D 80x10b, 64x12b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 125°C (TA)
Supplier Device Package 256-MAPPBGA (17x17) 256-MAPPBGA (17x17)
Part Number Manufacturer Description Request For Quote
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