TE0300-01IBM vs TE0300-01IBMLP

This detailed comparison of TE0300-01IBM and TE0300-01IBMLP in the Embedded - Microcontroller, Microprocessor, FPGA Modules provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

TE0300-01IBM

TE0300-01IBM

Trenz Electronic

TE0300-01IBMLP

TE0300-01IBMLP

Trenz Electronic

Specifications
Manufacturer Trenz Electronic Trenz Electronic
Package / Case - -
Description IC MOD SPARTAN-3E 125MHZ 64MB IC MOD SPARTAN-3E 100MHZ 64MB
In Stock 0 0
Mounting Type - -
Part Status Not For New Designs Not For New Designs
Series TE0300 TE0300
Package Bulk Bulk
Module/Board Type FPGA, USB Core FPGA, USB Core
Core Processor Spartan-3E Spartan-3E
Co-Processor Cypress FX2 USB 2.0 Cypress FX2 USB 2.0
Speed 125MHz 100MHz
Flash Size 4MB 4MB
RAM Size 64MB 64MB
Connector Type B2B B2B
Size / Dimension 1.6" x 1.9" (40.5mm x 47.5mm) 1.6" x 1.9" (40.5mm x 47.5mm)
Operating Temperature 0°C ~ 70°C 0°C ~ 70°C
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