TMS5704357BGWTEP vs TMS5704357BZWTQQ1

This detailed comparison of TMS5704357BGWTEP and TMS5704357BZWTQQ1 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

TMS5704357BGWTEP

Texas Instruments

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TMS5704357BZWTQQ1

Texas Instruments

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Specifications Hide identical items

Manufacturer	Texas Instruments	Texas Instruments
Package / Case	337-LFBGA	337-LFBGA
Description	IC MCU 32BIT 4MB FLASH 337NFBGA	IC MCU 32BIT 4MB FLASH 337NFBGA
In Stock	2 550	835
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	Hercules™	Automotive, AEC-Q100, Hercules™ TMS570 ARM® Cortex®-R
Package	Tray	Tray
Core Processor	ARM® Cortex®-R5F	ARM® Cortex®-R5F
Core Size	32-Bit	32-Bit
Speed	300MHz	300MHz
Connectivity	CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, MibSPI, SCI, SPI, UART/USART	CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals	DMA, POR, PWM, WDT	DMA, POR, PWM, WDT
Number of I/O	145	145
Program Memory Size	4MB (4M x 8)	4MB (4M x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	128K x 8	128K x 8
RAM Size	512K x 8	512K x 8
Voltage - Supply (Vcc/Vdd)	1.14V ~ 1.32V	3V ~ 3.6V
Data Converters	A/D 41x12b	A/D 41x12b
Oscillator Type	Internal	Internal
Operating Temperature	-55°C ~ 125°C (TA)	-40°C ~ 125°C (TA)
Supplier Device Package	337-NFBGA (16x16)	337-NFBGA (16x16)