UPD70F3231M2GB(A2)-8EU-A vs UPD70F3231VM1GBA-GAH-QS-AX

This detailed comparison of UPD70F3231M2GB(A2)-8EU-A and UPD70F3231VM1GBA-GAH-QS-AX in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

UPD70F3231M2GB(A2)-8EU-A

UPD70F3231M2GB(A2)-8EU-A

Renesas Electronics America

UPD70F3231VM1GBA-GAH-QS-AX

UPD70F3231VM1GBA-GAH-QS-AX

Renesas Electronics America

Specifications
Manufacturer Renesas Electronics America Renesas Electronics America
Package / Case 64-LQFP 64-LQFP
Description IC MCU 32BIT 128KB FLASH 64LFQFP IC MCU 32BIT 128KB FLASH 64LFQFP
In Stock 2 500 1 229
Mounting Type Surface Mount Surface Mount
Part Status Obsolete Obsolete
Series V850ES/Fx2 V850ES/Fx2
Package Tape & Reel (TR) Tape & Reel (TR)
Core Processor V850ES V850ES
Core Size 32-Bit 32-Bit
Speed 20MHz 20MHz
Connectivity CANbus, CSI, I²C, UART/USART CANbus, CSI, I²C, UART/USART
Peripherals LVD, PWM, WDT LVD, PWM, WDT
Number of I/O 51 51
Program Memory Size 128KB (128K x 8) 128KB (128K x 8)
Program Memory Type FLASH FLASH
EEPROM Size - -
RAM Size 6K x 8 6K x 8
Voltage - Supply (Vcc/Vdd) 3.5V ~ 5.5V 3.5V ~ 5.5V
Data Converters A/D 10x10b A/D 10x10b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 85°C (TA)
Supplier Device Package 64-LFQFP (10x10) 64-LFQFP (10x10)
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