UPD70F3233M2GKA1-V15-GAK-G vs UPD70F3233M2GK(A1)-GAK-QS-AX

This detailed comparison of UPD70F3233M2GKA1-V15-GAK-G and UPD70F3233M2GK(A1)-GAK-QS-AX in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

UPD70F3233M2GKA1-V15-GAK-G

UPD70F3233M2GKA1-V15-GAK-G

Renesas Electronics America

UPD70F3233M2GK(A1)-GAK-QS-AX

UPD70F3233M2GK(A1)-GAK-QS-AX

Renesas Electronics America

Specifications
Manufacturer Renesas Electronics America Renesas Electronics America
Package / Case 80-TQFP 80-TQFP
Description IC MCU 32BIT 256KB FLASH 80TFQFP IC MCU 32BIT 256KB FLASH 80TFQFP
In Stock 1 256 7 074
Mounting Type Surface Mount Surface Mount
Part Status Obsolete Obsolete
Series V850ES/Fx2 V850ES/Fx2
Package Tape & Reel (TR) Tape & Reel (TR)
Core Processor V850ES V850ES
Core Size 32-Bit 32-Bit
Speed 20MHz 20MHz
Connectivity CANbus, CSI, I²C, UART/USART CANbus, CSI, I²C, UART/USART
Peripherals LVD, PWM, WDT LVD, PWM, WDT
Number of I/O 67 67
Program Memory Size 256KB (256K x 8) 256KB (256K x 8)
Program Memory Type FLASH FLASH
EEPROM Size - -
RAM Size 12K x 8 12K x 8
Voltage - Supply (Vcc/Vdd) 3.5V ~ 5.5V 3.5V ~ 5.5V
Data Converters A/D 12x10b A/D 12x10b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 110°C (TA) -40°C ~ 110°C (TA)
Supplier Device Package 80-TFQFP (12x12) 80-TFQFP (12x12)
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