UPD70F3235M2GC(A)-UEU-E3-DE-AX vs UPD70F3235BM1GC(A2)-V53-8EA-A

This detailed comparison of UPD70F3235M2GC(A)-UEU-E3-DE-AX and UPD70F3235BM1GC(A2)-V53-8EA-A in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

UPD70F3235M2GC(A)-UEU-E3-DE-AX

Renesas Electronics America

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UPD70F3235BM1GC(A2)-V53-8EA-A

Renesas Electronics America

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Specifications Hide identical items

Manufacturer	Renesas Electronics America	Renesas Electronics America
Package / Case	100-LQFP	100-LQFP
Description	IC MCU 32BIT 256KB FLSH 100LFQFP	IC MCU 32BIT 256KB FLSH 100LFQFP
In Stock	1 160	1 464
Mounting Type	Surface Mount	Surface Mount
Part Status	Obsolete	Obsolete
Series	V850ES/Fx2	V850ES/Fx2
Package	Tape & Reel (TR)	Tape & Reel (TR)
Core Processor	V850ES	V850ES
Core Size	32-Bit	32-Bit
Speed	20MHz	20MHz
Connectivity	CANbus, CSI, I²C, UART/USART	CANbus, CSI, I²C, UART/USART
Peripherals	LVD, PWM, WDT	LVD, PWM, WDT
Number of I/O	84	84
Program Memory Size	256KB (256K x 8)	256KB (256K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	12K x 8	12K x 8
Voltage - Supply (Vcc/Vdd)	3.5V ~ 5.5V	3.5V ~ 5.5V
Data Converters	A/D 16x10b	A/D 16x10b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 125°C (TA)
Supplier Device Package	100-LFQFP (14x14)	100-LFQFP (14x14)