UPD70F3370AM1GBA-GAH-AX vs UPD70F3370AM2GBA1-GAH-E2-QS-AX

This detailed comparison of UPD70F3370AM1GBA-GAH-AX and UPD70F3370AM2GBA1-GAH-E2-QS-AX in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

UPD70F3370AM1GBA-GAH-AX

Renesas Electronics America

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UPD70F3370AM2GBA1-GAH-E2-QS-AX

Renesas Electronics America

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Specifications Hide identical items

Manufacturer	Renesas Electronics America	Renesas Electronics America
Package / Case	64-LQFP	64-LQFP
Description	IC MCU 32BIT 128KB FLASH 64LFQFP	IC MCU 32BIT 128KB FLASH 64LFQFP
In Stock	1 920	4 334
Mounting Type	Surface Mount	Surface Mount
Part Status	Obsolete	Obsolete
Series	V850ES/Fx3	V850ES/Fx3
Package	Tray	Tray
Core Processor	V850ES	V850ES
Core Size	32-Bit	32-Bit
Speed	32MHz	32MHz
Connectivity	CANbus, CSI, EBI/EMI, I²C, LINbus, UART/USART	CANbus, CSI, EBI/EMI, I²C, LINbus, UART/USART
Peripherals	DMA, LVD, POR, PWM, WDT	DMA, LVD, POR, PWM, WDT
Number of I/O	51	51
Program Memory Size	128KB (128K x 8)	128KB (128K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	32K x 8
RAM Size	8K x 8	8K x 8
Voltage - Supply (Vcc/Vdd)	3.3V ~ 5.5V	3.3V ~ 5.5V
Data Converters	A/D 10x10b	A/D 10x10b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 110°C (TA)
Supplier Device Package	64-LFQFP (10x10)	64-LFQFP (10x10)