UPD70F3557AM1GMA-GBK-E2-QS-AX vs UPD70F3558M1GM-GBK-AX#YF

This detailed comparison of UPD70F3557AM1GMA-GBK-E2-QS-AX and UPD70F3558M1GM-GBK-AX#YF in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

UPD70F3557AM1GMA-GBK-E2-QS-AX

Renesas Electronics America

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UPD70F3558M1GM-GBK-AX#YF

Renesas Electronics America

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Specifications Hide identical items

Manufacturer	Renesas Electronics America	Renesas Electronics America
Package / Case	176-LQFP Exposed Pad	176-LQFP Exposed Pad
Description	IC MCU 32BIT 1.5MB FLSH 176HLQFP	IC MCU 32BIT 2MB FLASH 176HLQFP
In Stock	2 500	7 430
Mounting Type	Surface Mount	Surface Mount
Part Status	Obsolete	Obsolete
Series	V850E2/Fx4	V850E2/Fx4
Package	Tray	Tray
Core Processor	V850E2	V850E2
Core Size	32-Bit	32-Bit
Speed	80MHz	80MHz
Connectivity	CANbus, CSI, I²C, LINbus, UART/USART	CANbus, CSI, I²C, LINbus, UART/USART
Peripherals	DMA, PWM, WDT	DMA, PWM, WDT
Number of I/O	136	136
Program Memory Size	1.5MB (1.5M x 8)	2MB (2M x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	64K x 8	64K x 8
RAM Size	112K x 8	144K x 8
Voltage - Supply (Vcc/Vdd)	3V ~ 5.5V	3V ~ 5.5V
Data Converters	A/D 40x12b	A/D 40x12b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	176-HLQFP (24x24)	176-HLQFP (24x24)