UPD70F3744GJ-GAE-AX vs UPD70F3746GJ-GAE-AX

This detailed comparison of UPD70F3744GJ-GAE-AX and UPD70F3746GJ-GAE-AX in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

UPD70F3744GJ-GAE-AX

Renesas Electronics America

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UPD70F3746GJ-GAE-AX

Renesas Electronics America

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Specifications Hide identical items

Manufacturer	Renesas Electronics America	Renesas Electronics America
Package / Case	144-LQFP	144-LQFP
Description	IC MCU 32BIT 512KB FLASH 144LQFP	IC MCU 32BIT 1MB FLASH 144LQFP
In Stock	4 272	1 047
Mounting Type	Surface Mount	Surface Mount
Part Status	Active	Active
Series	V850ES/Jx3	V850ES/Jx3
Package	Tray	Tray
Core Processor	V850ES	V850ES
Core Size	32-Bit	32-Bit
Speed	32MHz	32MHz
Connectivity	CSI, EBI/EMI, I²C, UART/USART	CSI, EBI/EMI, I²C, UART/USART
Peripherals	DMA, LVD, PWM, WDT	DMA, LVD, PWM, WDT
Number of I/O	128	128
Program Memory Size	512KB (512K x 8)	1MB (1M x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	40K x 8	60K x 8
Voltage - Supply (Vcc/Vdd)	2.85V ~ 3.6V	2.85V ~ 3.6V
Data Converters	A/D 16x10b; D/A 2x8b	A/D 16x10b; D/A 2x8b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	-	-