UPD70F3827GB(R)-GAH-AX vs UPD70F3829GB(R)-GAH-AX

This detailed comparison of UPD70F3827GB(R)-GAH-AX and UPD70F3829GB(R)-GAH-AX in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

UPD70F3827GB(R)-GAH-AX

Renesas Electronics America

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UPD70F3829GB(R)-GAH-AX

Renesas Electronics America

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Specifications Hide identical items

Manufacturer	Renesas Electronics America	Renesas Electronics America
Package / Case	64-LQFP	64-LQFP
Description	IC MCU 32BIT 128KB FLASH 64LQFP	IC MCU 32BIT 256KB FLASH 64LQFP
In Stock	1 623	2 500
Mounting Type	Surface Mount	Surface Mount
Part Status	Obsolete	Active
Series	V850ES/Jx3-E	V850ES/Jx3-E
Package	Tray	Tray
Core Processor	V850ES	V850ES
Core Size	32-Bit	32-Bit
Speed	50MHz	50MHz
Connectivity	CANbus, CSI, Ethernet, I²C, UART/USART, USB	CANbus, CSI, Ethernet, I²C, UART/USART, USB
Peripherals	DMA, LVD, PWM, WDT	DMA, LVD, PWM, WDT
Number of I/O	26	26
Program Memory Size	128KB (128K x 8)	256KB (256K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	48K x 8	64K x 8
Voltage - Supply (Vcc/Vdd)	2.85V ~ 3.6V	2.85V ~ 3.6V
Data Converters	A/D 10x10b	A/D 10x10b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	-	-