UPD70F3828GB(R)-GAH-AX vs UPD70F3829GB(R)-GAH-AX

This detailed comparison of UPD70F3828GB(R)-GAH-AX and UPD70F3829GB(R)-GAH-AX in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

UPD70F3828GB(R)-GAH-AX

UPD70F3828GB(R)-GAH-AX

Renesas Electronics America

UPD70F3829GB(R)-GAH-AX

UPD70F3829GB(R)-GAH-AX

Renesas Electronics America

Specifications
Manufacturer Renesas Electronics America Renesas Electronics America
Package / Case 64-LQFP 64-LQFP
Description IC MCU 32BIT 256KB FLASH 64LQFP IC MCU 32BIT 256KB FLASH 64LQFP
In Stock 2 424 2 500
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series V850ES/Jx3-E V850ES/Jx3-E
Package Tray Tray
Core Processor V850ES V850ES
Core Size 32-Bit 32-Bit
Speed 50MHz 50MHz
Connectivity CANbus, CSI, Ethernet, I²C, UART/USART, USB CANbus, CSI, Ethernet, I²C, UART/USART, USB
Peripherals DMA, LVD, PWM, WDT DMA, LVD, PWM, WDT
Number of I/O 26 26
Program Memory Size 256KB (256K x 8) 256KB (256K x 8)
Program Memory Type FLASH FLASH
EEPROM Size - -
RAM Size 64K x 8 64K x 8
Voltage - Supply (Vcc/Vdd) 2.85V ~ 3.6V 2.85V ~ 3.6V
Data Converters A/D 10x10b A/D 10x10b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Supplier Device Package - -
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