W25Q256FVBIF TR vs W25Q256FVBIG TR

This detailed comparison of W25Q256FVBIF TR and W25Q256FVBIG TR in the Memory provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

W25Q256FVBIF TR

W25Q256FVBIF TR

Winbond Electronics Corporation

W25Q256FVBIG TR

W25Q256FVBIG TR

Winbond Electronics Corporation

Specifications
Manufacturer Winbond Electronics Corporation Winbond Electronics Corporation
Package / Case 24-TBGA 24-TBGA
Description IC FLSH 256MBIT SPI/QUAD 24TFBGA IC FLSH 256MBIT SPI/QUAD 24TFBGA
In Stock 4 000 2 000
Mounting Type Surface Mount Surface Mount
Part Status Discontinued at Digi-Key Discontinued at Digi-Key
Series SpiFlash® SpiFlash®
Package Tape & Reel (TR) Tape & Reel (TR)
Memory Type Non-Volatile Non-Volatile
Memory Format FLASH FLASH
Technology FLASH - NOR FLASH - NOR
Memory Size 256Mb (32M x 8) 256Mb (32M x 8)
Memory Interface SPI - Quad I/O, QPI SPI - Quad I/O, QPI
Clock Frequency 104 MHz 104 MHz
Write Cycle Time - Word, Page 50µs, 3ms 50µs, 3ms
Access Time - -
Voltage - Supply 2.7V ~ 3.6V 2.7V ~ 3.6V
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Supplier Device Package 24-TFBGA (6x8) 24-TFBGA (6x8)
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