W25Q32JVXGJQ vs W25Q64JVXGJM TR

This detailed comparison of W25Q32JVXGJQ and W25Q64JVXGJM TR in the Memory provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

W25Q32JVXGJQ

W25Q32JVXGJQ

Winbond Electronics Corporation

W25Q64JVXGJM TR

W25Q64JVXGJM TR

Winbond Electronics Corporation

Specifications
Manufacturer Winbond Electronics Corporation Winbond Electronics Corporation
Package / Case 8-XDFN Exposed Pad 8-XDFN Exposed Pad
Description IC FLASH 32MBIT SPI/QUAD 8XSON IC FLASH 64MBIT SPI/QUAD 8XSON
In Stock 5 000 4 986
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series SpiFlash® SpiFlash®
Package Tube Tape & Reel (TR)
Memory Type Non-Volatile Non-Volatile
Memory Format FLASH FLASH
Technology FLASH - NOR FLASH - NOR
Memory Size 32Mb (4M x 8) 64Mb (8M x 8)
Memory Interface SPI - Quad I/O SPI - Quad I/O
Clock Frequency 133 MHz 133 MHz
Write Cycle Time - Word, Page 3ms 3ms
Access Time - -
Voltage - Supply 2.7V ~ 3.6V 2.7V ~ 3.6V
Operating Temperature -40°C ~ 105°C (TA) -40°C ~ 105°C (TA)
Supplier Device Package 8-XSON (4x4) 8-XSON (4x4)
Part Number Manufacturer Description Request For Quote
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