W978H2KBVX2E vs W979H6KBVX2I TR

This detailed comparison of W978H2KBVX2E and W979H6KBVX2I TR in the Memory provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

W978H2KBVX2E

W978H2KBVX2E

Winbond Electronics Corporation

W979H6KBVX2I TR

W979H6KBVX2I TR

Winbond Electronics Corporation

Specifications
Manufacturer Winbond Electronics Corporation Winbond Electronics Corporation
Package / Case 134-VFBGA 134-VFBGA
Description IC DRAM 256MBIT PAR 134VFBGA IC DRAM 512MBIT PAR 134VFBGA
In Stock 9 000 5 278
Mounting Type Surface Mount Surface Mount
Part Status Active Active
Series - -
Package Tray Tape & Reel (TR)
Memory Type Volatile Volatile
Memory Format DRAM DRAM
Technology SDRAM - Mobile LPDDR2 SDRAM - Mobile LPDDR2
Memory Size 256Mb (8M x 32) 512Mb (32M x 16)
Memory Interface Parallel Parallel
Clock Frequency 400 MHz 400 MHz
Write Cycle Time - Word, Page 15ns 15ns
Access Time - -
Voltage - Supply 1.14V ~ 1.95V 1.14V ~ 1.95V
Operating Temperature -25°C ~ 85°C (TC) -40°C ~ 85°C (TA)
Supplier Device Package 134-VFBGA (10x11.5) 134-VFBGA (10x11.5)
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