XC1701LPDG8C vs EPC1PC8

This detailed comparison of XC1701LPDG8C and EPC1PC8 in the Memory - Configuration Proms for FPGAs provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

XC1701LPDG8C

XC1701LPDG8C

Xilinx

EPC1PC8

EPC1PC8

Intel

Specifications
Manufacturer Xilinx Intel
Package / Case 8-DIP (0.300", 7.62mm) 8-DIP (0.300", 7.62mm)
Description IC PROM SER CONFIG 1M 3.3V 8-DIP IC CONFIG DEVICE 1MBIT 8DIP
In Stock 510 408
Mounting Type Through Hole Through Hole
Part Status Obsolete Obsolete
Series - EPC
Package Tube Tube
Programmable Type OTP OTP
Memory Size 1Mb 1Mb
Voltage - Supply 3V ~ 3.6V 3V ~ 3.6V, 4.75V ~ 5.25V
Operating Temperature 0°C ~ 70°C 0°C ~ 70°C
Supplier Device Package 8-PDIP 8-PDIP
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