XC17S200APD8I vs XC17S200APDG8I

This detailed comparison of XC17S200APD8I and XC17S200APDG8I in the Memory - Configuration Proms for FPGAs provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

XC17S200APD8I

XC17S200APD8I

Xilinx

XC17S200APDG8I

XC17S200APDG8I

Xilinx

Specifications
Manufacturer Xilinx Xilinx
Package / Case 8-DIP (0.300", 7.62mm) 8-DIP (0.300", 7.62mm)
Description IC PROM SER 200000 I-TEMP 8-DIP IC PROM SER 200K I-TEMP 8-DIP
In Stock 356 384
Mounting Type Through Hole Through Hole
Part Status Obsolete Obsolete
Series - -
Package Tube Tube
Programmable Type OTP OTP
Memory Size 2Mb 2Mb
Voltage - Supply 3V ~ 3.6V 3V ~ 3.6V
Operating Temperature -40°C ~ 85°C -40°C ~ 85°C
Supplier Device Package 8-PDIP 8-PDIP
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