XC2766X96F66LACKXUMA1 vs XE164F72F66LACFXQMA1

This detailed comparison of XC2766X96F66LACKXUMA1 and XE164F72F66LACFXQMA1 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

XC2766X96F66LACKXUMA1

IR (Infineon Technologies)

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XE164F72F66LACFXQMA1

IR (Infineon Technologies)

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Specifications Hide identical items

Manufacturer	IR (Infineon Technologies)	IR (Infineon Technologies)
Package / Case	100-LQFP Exposed Pad	100-LQFP Exposed Pad
Description	IC MCU 16/32B 768KB FLSH 100LQFP	IC MCU 16BIT 576KB FLASH 100LQFP
In Stock	160	2 270
Mounting Type	Surface Mount	Surface Mount
Part Status	Not For New Designs	Obsolete
Series	XC27x6X	XE16x
Package	Tape & Reel (TR)Cut Tape (CT)Digi-Reel®	Tray
Core Processor	C166SV2	C166SV2
Core Size	16/32-Bit	16-Bit
Speed	66MHz	66MHz
Connectivity	CANbus, EBI/EMI, I²C, LINbus, SPI, SSC, UART/USART, USI	CANbus, EBI/EMI, I²C, LINbus, SPI, SSC, UART/USART, USI
Peripherals	I²S, POR, PWM, WDT	I²S, POR, PWM, WDT
Number of I/O	75	75
Program Memory Size	768KB (768K x 8)	576KB (576K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	51K x 8	50K x 8
Voltage - Supply (Vcc/Vdd)	3V ~ 5.5V	3V ~ 5.5V
Data Converters	A/D 16x10b	A/D 16x10b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 125°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	PG-LQFP-100-3	PG-LQFP-100-3