XC4062XL-3BG432I vs XCV300-4BG432I

This detailed comparison of XC4062XL-3BG432I and XCV300-4BG432I in the Embedded - FPGAs (Field Programmable Gate Array) provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

XC4062XL-3BG432I

XC4062XL-3BG432I

Xilinx

XCV300-4BG432I

XCV300-4BG432I

Xilinx

Specifications
Manufacturer Xilinx Xilinx
Package / Case 432-LBGA Exposed Pad, Metal 432-LBGA Exposed Pad, Metal
Description IC FPGA 352 I/O 432MBGA IC FPGA 316 I/O 432MBGA
In Stock 857 438
Mounting Type Surface Mount Surface Mount
Part Status Obsolete Obsolete
Series XC4000E/X Virtex®
Package Tray Tray
Number of LABs/CLBs 2304 1536
Number of Logic Elements/Cells 5472 6912
Total RAM Bits 73728 65536
Number of I/O 352 316
Number of Gates 62000 322970
Voltage - Supply 3V ~ 3.6V 2.375V ~ 2.625V
Operating Temperature -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ)
Supplier Device Package 432-MBGA (40x40) 432-MBGA (40x40)
Part Number Manufacturer Description Request For Quote
XCV1000E-7BG560C Xilinx IC FPGA 404 I/O 560MBGA
A54SX08-PLG84 Microsemi IC FPGA 69 I/O 84PLCC
EP3SE260F1517C4NAA Intel IC FPGA STRATIX III FLIP CHIP
XC4062XL-2HQ240C Xilinx IC FPGA 193 I/O 240QFP
5SGXEA7N2F45I2CV Intel IC FPGA 840 I/O 1932FCBGA
AGLE3000V5-FG896I Microsemi IC FPGA 620 I/O 896FBGA
5SGXMA3K3F40I3WN Intel IC FPGA STRATIX V GX FLIP CHIP
EP2AGX260FF35I3NGA Intel IC FPGA 612 I/O 1152FBGA
A3P600L-FGG256I Microsemi IC FPGA 177 I/O 256FBGA
M1AGL600V2-FGG484I Microsemi IC FPGA 235 I/O 484FBGA
5AGXBB1D4F35C4NAA Intel IC FPGA 544 I/O 1152FBGA
XCV100-5PQ240C Xilinx IC FPGA 166 I/O 240QFP
XCV200E-7BG352I Xilinx IC FPGA 260 I/O 352MBGA
A3P250L-PQ208 Microsemi IC FPGA 151 I/O 208QFP
XC4013E-2PG223C Xilinx IC FPGA 192 I/O 223CPGA
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