XC4062XL-3BG560C vs XCV600-6BG560C

This detailed comparison of XC4062XL-3BG560C and XCV600-6BG560C in the Embedded - FPGAs (Field Programmable Gate Array) provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

XC4062XL-3BG560C

XC4062XL-3BG560C

Xilinx

XCV600-6BG560C

XCV600-6BG560C

VIGOR

Specifications
Manufacturer Xilinx VIGOR
Package / Case 560-LBGA Exposed Pad, Metal 560-LBGA Exposed Pad, Metal
Description IC FPGA 384 I/O 560MBGA FPGA, 3456 CLBS, 661111 GATES, 3
In Stock 838 67
Mounting Type Surface Mount Surface Mount
Part Status Obsolete Active
Series XC4000E/X Virtex®
Package Tray Bulk
Number of LABs/CLBs 2304 -
Number of Logic Elements/Cells 5472 -
Total RAM Bits 73728 -
Number of I/O 384 404
Number of Gates 62000 -
Voltage - Supply 3V ~ 3.6V 2.375V ~ 2.625V
Operating Temperature 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ)
Supplier Device Package 560-MBGA (42.5x42.5) 560-MBGA (42.5x42.5)
Part Number Manufacturer Description Request For Quote
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XC2V500-6FGG256C Xilinx IC FPGA 172 I/O 256FBGA
A3P250L-1FG144 Microsemi IC FPGA 97 I/O 144FBGA
MPF300XT-FCG1152E Microsemi IC FPGA 512 I/O 1152FCBGA
EP3SE260F1517I3AA Intel IC FPGA 976 I/O 1517FBGA
5962-9215602MXC Microsemi IC FPGA 140 I/O 176CPGA
EPF10K200EGI599-3 Intel IC FPGA 470 I/O 599PGA
EP2SGX60DF780C4G Intel IC FPGA 364 I/O 780FBGA
EP20K1000EGC984-1 Intel IC FPGA
LFSC3GA40E-5FFA1020C Lattice Semiconductor IC FPGA 562 I/O 1020BGA
EP4SGX530KH40C4NGA Intel IC FPGA STRATIX IV GX FLIP CHIP
5SGSMD6K3F40C3NCV Intel IC FPGA STRATIX V GS FLIP CHIP
M1AFS600-2PQG208 Microsemi IC FPGA 95 I/O 208QFP
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