XC56L307VL150 vs SPAKXCL307VL160

This detailed comparison of XC56L307VL150 and SPAKXCL307VL160 in the Embedded - DSP (Digital Signal Processors) provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

XC56L307VL150

XC56L307VL150

NXP Semiconductors

SPAKXCL307VL160

SPAKXCL307VL160

NXP Semiconductors

Specifications
Manufacturer NXP Semiconductors NXP Semiconductors
Package / Case 196-LBGA 196-LBGA
Description IC DSP 24BIT 150MHZ 196-MABGA IC DSP 24BIT 160MHZ 196-MAPBGA
In Stock 638 2 242
Mounting Type Surface Mount Surface Mount
Part Status Obsolete Obsolete
Series DSP563xx DSP563xx
Package Tray Tray
Type Fixed Point Fixed Point
Interface Host Interface, SSI, SCI Host Interface, SSI, SCI
Clock Rate 150MHz 160MHz
Non-Volatile Memory ROM (576B) ROM (576B)
On-Chip RAM 576kB 576kB
Voltage - I/O 3.30V 3.30V
Voltage - Core 1.80V 1.80V
Operating Temperature -40°C ~ 100°C -40°C ~ 100°C
Supplier Device Package 196-MAPBGA (15x15) 196-MAPBGA (15x15)
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