XCV200-4BG352C vs XCV300-6BG352C

This detailed comparison of XCV200-4BG352C and XCV300-6BG352C in the Embedded - FPGAs (Field Programmable Gate Array) provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

XCV200-4BG352C

XCV200-4BG352C

Xilinx

XCV300-6BG352C

XCV300-6BG352C

Xilinx

Specifications
Manufacturer Xilinx Xilinx
Package / Case 352-LBGA Exposed Pad, Metal 352-LBGA Exposed Pad, Metal
Description IC FPGA 260 I/O 352MBGA IC FPGA 260 I/O 352MBGA
In Stock 684 397
Mounting Type Surface Mount Surface Mount
Part Status Obsolete Obsolete
Series Virtex® Virtex®
Package Tray Tray
Number of LABs/CLBs 1176 1536
Number of Logic Elements/Cells 5292 6912
Total RAM Bits 57344 65536
Number of I/O 260 260
Number of Gates 236666 322970
Voltage - Supply 2.375V ~ 2.625V 2.375V ~ 2.625V
Operating Temperature 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ)
Supplier Device Package 352-MBGA (35x35) 352-MBGA (35x35)
Part Number Manufacturer Description Request For Quote
5SGSMD5K3F40C2WN Intel IC FPGA STRATIX V GS FLIP CHIP
XCV600-5BG432I Xilinx IC FPGA 316 I/O 432MBGA
5AGXFB1H6F40C6N Intel IC FPGA 704 I/O 1517FBGA
XCV300-4BG432I Xilinx IC FPGA 316 I/O 432MBGA
XC4010XL-09TQ176C Xilinx IC FPGA 145 I/O 176TQFP
XCV200-6BG352C Xilinx IC FPGA 260 I/O 352MBGA
EP4SEF35I4NAB Intel IC FPGA STRATIX IV E FLIP CHIP
A1240A-1PG132B Microsemi IC FPGA 104 I/O 132CPGA
XC4013E-1PQ160C Xilinx IC FPGA 129 I/O 160QFP
LX64EV-5F100I Lattice Semiconductor IC FPGA 64 I/O 100FBGA
XC2V250-6FG256C Xilinx IC FPGA 172 I/O 256FBGA
MPF10K130EFC484XBB Intel IC FPGA
M2GL100-1FCG1152 Microsemi IC FPGA 574 I/O 1152FCBGA
XC4020E-1PG223C Xilinx IC FPGA 192 I/O 223CPGA
5SGXMA3E2H29C2WN Intel IC FPGA STRATIX V GX FLIP CHIP
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