XCV200-5BG352C vs XCV300-6BG352C

This detailed comparison of XCV200-5BG352C and XCV300-6BG352C in the Embedded - FPGAs (Field Programmable Gate Array) provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

XCV200-5BG352C

XCV200-5BG352C

Xilinx

XCV300-6BG352C

XCV300-6BG352C

Xilinx

Specifications
Manufacturer Xilinx Xilinx
Package / Case 352-LBGA Exposed Pad, Metal 352-LBGA Exposed Pad, Metal
Description IC FPGA 260 I/O 352MBGA IC FPGA 260 I/O 352MBGA
In Stock 732 397
Mounting Type Surface Mount Surface Mount
Part Status Obsolete Obsolete
Series Virtex® Virtex®
Package Tray Tray
Number of LABs/CLBs 1176 1536
Number of Logic Elements/Cells 5292 6912
Total RAM Bits 57344 65536
Number of I/O 260 260
Number of Gates 236666 322970
Voltage - Supply 2.375V ~ 2.625V 2.375V ~ 2.625V
Operating Temperature 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ)
Supplier Device Package 352-MBGA (35x35) 352-MBGA (35x35)
Part Number Manufacturer Description Request For Quote
EP2S90F1020C3G Intel IC FPGA 758 I/O 1020FBGA
5SGSMD3H3F35C3WN Intel IC FPGA STRATIX V GS FLIP CHIP
XCV150-5PQ240C Xilinx IC FPGA 166 I/O 240QFP
5SGXMA7K1F35C1WN Intel IC FPGA STRATIX V GX FLIP CHIP
A1460A-PQG208I Microsemi IC FPGA 167 I/O 208QFP
EP20K100FC196-1X Intel IC FPGA 196BGA
A3P250-1FG144M Roving Networks / Microchip Technology IC FPGA 97 I/O 144FBGA
A54SX16P-PQ208M Roving Networks / Microchip Technology IC FPGA 175 I/O 208QFP
EP2S30F672C5RB Altera (Intel) IC FPGA 500 I/O 672FBGA
AX1000-2FGG896I Microsemi IC FPGA 516 I/O 896FBGA
XC4052XL-3BG560C Xilinx IC FPGA 352 I/O 560MBGA
10AT115U3F45E2SGE2 Intel IC FPGA 624 I/O 1932FCBGA
A14V40A-TQG176C Microsemi IC FPGA 140 I/O 176TQFP
EP2S15F672C3G Intel IC FPGA 366 I/O 672FBGA
A3P250L-PQ208I Microsemi IC FPGA 151 I/O 208QFP
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