XCV300-4BG352I vs XCV300E-7BG352I

This detailed comparison of XCV300-4BG352I and XCV300E-7BG352I in the Embedded - FPGAs (Field Programmable Gate Array) provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

XCV300-4BG352I

XCV300-4BG352I

Xilinx

XCV300E-7BG352I

XCV300E-7BG352I

Xilinx

Specifications
Manufacturer Xilinx Xilinx
Package / Case 352-LBGA Exposed Pad, Metal 352-LBGA Exposed Pad, Metal
Description IC FPGA 260 I/O 352MBGA IC FPGA 260 I/O 352MBGA
In Stock 469 730
Mounting Type Surface Mount Surface Mount
Part Status Obsolete Obsolete
Series Virtex® Virtex®-E
Package Tray Tray
Number of LABs/CLBs 1536 1536
Number of Logic Elements/Cells 6912 6912
Total RAM Bits 65536 131072
Number of I/O 260 260
Number of Gates 322970 411955
Voltage - Supply 2.375V ~ 2.625V 1.71V ~ 1.89V
Operating Temperature -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ)
Supplier Device Package 352-MBGA (35x35) 352-MBGA (35x35)
Part Number Manufacturer Description Request For Quote
A54SX32-1PQ208 Roving Networks / Microchip Technology IC FPGA 174 I/O 208QFP
LFSC3GA40E-6FFA1020C Lattice Semiconductor IC FPGA 562 I/O 1020BGA
5SGXEB5R2F43I3NAB Intel IC FPGA STRATIX V GX FLIP CHIP
ORT82G5-1FN680I Lattice Semiconductor IC FPGA 372 I/O 680FBGA
XCV1000E-6BG560I Xilinx IC FPGA 404 I/O 560MBGA
XCV300E-8BG352C Xilinx IC FPGA 260 I/O 352MBGA
5SGXMA7H2F35C2WN Intel IC FPGA STRATIX V GX FLIP CHIP
5SGXMA7K2F40I3W Intel IC FPGA 696 I/O 1517FBGA
5SGXMA4H2F35C1WN Intel IC FPGA STRATIX V GX FLIP CHIP
5SGSMD5K3F40I4WN Intel IC FPGA STRATIX V GS FLIP CHIP
A54SX16-2TQ176 Microsemi IC FPGA 147 I/O 176TQFP
5SGXMA5K3F35C4WN Intel IC FPGA STRATIX V GX FLIP CHIP
XC4025E-4PG223I Xilinx IC FPGA 192 I/O 223CPGA
XC2V2000-5BF957I Xilinx IC FPGA 624 I/O 957FCBGA
5SGXMA5K3F40I4WN Intel IC FPGA STRATIX V GX FLIP CHIP
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