XCV300-6BG352C vs XCV300E-7BG352I

This detailed comparison of XCV300-6BG352C and XCV300E-7BG352I in the Embedded - FPGAs (Field Programmable Gate Array) provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

XCV300-6BG352C

XCV300-6BG352C

Xilinx

XCV300E-7BG352I

XCV300E-7BG352I

Xilinx

Specifications
Manufacturer Xilinx Xilinx
Package / Case 352-LBGA Exposed Pad, Metal 352-LBGA Exposed Pad, Metal
Description IC FPGA 260 I/O 352MBGA IC FPGA 260 I/O 352MBGA
In Stock 397 730
Mounting Type Surface Mount Surface Mount
Part Status Obsolete Obsolete
Series Virtex® Virtex®-E
Package Tray Tray
Number of LABs/CLBs 1536 1536
Number of Logic Elements/Cells 6912 6912
Total RAM Bits 65536 131072
Number of I/O 260 260
Number of Gates 322970 411955
Voltage - Supply 2.375V ~ 2.625V 1.71V ~ 1.89V
Operating Temperature 0°C ~ 85°C (TJ) -40°C ~ 100°C (TJ)
Supplier Device Package 352-MBGA (35x35) 352-MBGA (35x35)
Part Number Manufacturer Description Request For Quote
LFXP10E-3F388I Lattice Semiconductor IC FPGA 244 I/O 388FBGA
XCV1600E-7FG860C Xilinx IC FPGA 660 I/O 860FBGA
EP2S130F1020C3NRB Intel IC FPGA 742 I/O 1020FBGA
A1460A-CQ196B Microsemi IC FPGA 168 I/O 196CQFP
A14V40A-TQ176C Microsemi IC FPGA 140 I/O 176TQFP
5AGXFB5K4F40I5N Intel IC FPGA 704 I/O 1517FBGA
EP3SL200F1152I3AA Intel IC FPGA 744 I/O 1152FBGA
5962-9215601MYC Microsemi IC FPGA 140 I/O 172CQFP
A14100A-1PG257C Microsemi IC FPGA 228 I/O 257CPGA
5AGXA5F35I3NAD Intel IC FPGA 544 I/O 1152FBGA
XC3090A-7PQ160C Xilinx IC FPGA 138 I/O 160QFP
A14V60A-PQ208C Microsemi IC FPGA 167 I/O 208QFP
AFS090-2QNG108 Microsemi IC FPGA 37 I/O 108QFN
5SGXMA5K3F40C3NCV Intel IC FPGA STRATIX V GX FLIP CHIP
5SGXEA4K3F35I3NYY Intel IC FPGA STRATIX V GX FLIP CHIP
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