XCV300E-7BG352C vs XCV300E-8BG352C

This detailed comparison of XCV300E-7BG352C and XCV300E-8BG352C in the Embedded - FPGAs (Field Programmable Gate Array) provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

XCV300E-7BG352C

XCV300E-7BG352C

Xilinx

XCV300E-8BG352C

XCV300E-8BG352C

Xilinx

Specifications
Manufacturer Xilinx Xilinx
Package / Case 352-LBGA Exposed Pad, Metal 352-LBGA Exposed Pad, Metal
Description IC FPGA 260 I/O 352MBGA IC FPGA 260 I/O 352MBGA
In Stock 868 422
Mounting Type Surface Mount Surface Mount
Part Status Obsolete Obsolete
Series Virtex®-E Virtex®-E
Package Tray Tray
Number of LABs/CLBs 1536 1536
Number of Logic Elements/Cells 6912 6912
Total RAM Bits 131072 131072
Number of I/O 260 260
Number of Gates 411955 411955
Voltage - Supply 1.71V ~ 1.89V 1.71V ~ 1.89V
Operating Temperature 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ)
Supplier Device Package 352-MBGA (35x35) 352-MBGA (35x35)
Part Number Manufacturer Description Request For Quote
LFXP20E-5FN388C Lattice Semiconductor IC FPGA 268 I/O 388FBGA
XC2VP2-5FGG256C Xilinx IC FPGA 140 I/O 256FBGA
M1AFS250-1PQG208 Microsemi IC FPGA 93 I/O 208QFP
XCV400-4BG560C Xilinx IC FPGA 404 I/O 560MBGA
A54SX08-1TQG176I Microsemi IC FPGA 128 I/O 176TQFP
5SGXEA7K3F40C3W Intel IC FPGA 696 I/O 1517FBGA
XC2VP4-5FGG256I Xilinx IC FPGA 140 I/O 256FBGA
5AGXFB7K4F40I3NAB Intel IC FPGA ARRIA V GX FLIP CHIP
A14100A-1PG257M Microsemi IC FPGA 228 I/O 257CPGA
ORT8850H-2BMN680C Lattice Semiconductor IC FPGA 297 I/O 680FBGA
5SGXMA7H3F35I4WN Intel IC FPGA STRATIX V GX FLIP CHIP
5SGSMD3H3F35I3WN Intel IC FPGA STRATIX V GS FLIP CHIP
EP2A15B652C8 Intel IC FPGA
5SGXMA3K2F40C2WN Intel IC FPGA STRATIX V GX FLIP CHIP
EP1S25F672C8NGA Intel IC FPGA 473 I/O 672FBGA
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