XCV300E-7BG352I vs XCV300E-6BG352I

This detailed comparison of XCV300E-7BG352I and XCV300E-6BG352I in the Embedded - FPGAs (Field Programmable Gate Array) provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

XCV300E-7BG352I

XCV300E-7BG352I

Xilinx

XCV300E-6BG352I

XCV300E-6BG352I

Xilinx

Specifications
Manufacturer Xilinx Xilinx
Package / Case 352-LBGA Exposed Pad, Metal 352-LBGA Exposed Pad, Metal
Description IC FPGA 260 I/O 352MBGA IC FPGA 260 I/O 352MBGA
In Stock 730 720
Mounting Type Surface Mount Surface Mount
Part Status Obsolete Obsolete
Series Virtex®-E Virtex®-E
Package Tray Tray
Number of LABs/CLBs 1536 1536
Number of Logic Elements/Cells 6912 6912
Total RAM Bits 131072 131072
Number of I/O 260 260
Number of Gates 411955 411955
Voltage - Supply 1.71V ~ 1.89V 1.71V ~ 1.89V
Operating Temperature -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ)
Supplier Device Package 352-MBGA (35x35) 352-MBGA (35x35)
Part Number Manufacturer Description Request For Quote
XC4005E-2PQ160I Xilinx IC FPGA 112 I/O 160QFP
LFSCM3GA115EP1-5FC1152C Lattice Semiconductor IC FPGA 660 I/O 1152FCBGA
XC2VP100-5FF1696I Xilinx IC FPGA 1164 I/O 1696FCBGA
5SGXMA4H1F35C1WN Intel IC FPGA STRATIX V GX FLIP CHIP
LFSC3GA115E-6FF1704C Lattice Semiconductor IC FPGA 942 I/O 1704FCBGA
5SGSMD5K3F40C3NCV Intel IC FPGA STRATIX V GS FLIP CHIP
5962-9215602MYA Microsemi IC FPGA 140 I/O 172CQFP
XCV300E-7PQ240I Xilinx IC FPGA 158 I/O 240QFP
M1A3PE3000L-1PQ208I Roving Networks / Microchip Technology IC FPGA 147 I/O 208QFP
A1425A-1CQ132B Microsemi IC FPGA 100 I/O 132CQFP
5SGXMA4K3F40I4WN Intel IC FPGA STRATIX V GX FLIP CHIP
AGL250V2-VQ100T Microsemi IC FPGA 68 I/O 100VQFP
AFS250-PQ208I Microsemi IC FPGA 93 I/O 208QFP
5SGXEA7N2F45I2WN Intel IC FPGA STRATIX V GX FLIP CHIP
A1440A-1PLG84C Microsemi IC FPGA 70 I/O 84PLCC
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