XCV300E-8BG352C vs XCV200E-6BG352C

This detailed comparison of XCV300E-8BG352C and XCV200E-6BG352C in the Embedded - FPGAs (Field Programmable Gate Array) provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

XCV300E-8BG352C

XCV300E-8BG352C

Xilinx

XCV200E-6BG352C

XCV200E-6BG352C

Xilinx

Specifications
Manufacturer Xilinx Xilinx
Package / Case 352-LBGA Exposed Pad, Metal 352-LBGA Exposed Pad, Metal
Description IC FPGA 260 I/O 352MBGA IC FPGA 260 I/O 352MBGA
In Stock 422 745
Mounting Type Surface Mount Surface Mount
Part Status Obsolete Obsolete
Series Virtex®-E Virtex®-E
Package Tray Tray
Number of LABs/CLBs 1536 1176
Number of Logic Elements/Cells 6912 5292
Total RAM Bits 131072 114688
Number of I/O 260 260
Number of Gates 411955 306393
Voltage - Supply 1.71V ~ 1.89V 1.71V ~ 1.89V
Operating Temperature 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ)
Supplier Device Package 352-MBGA (35x35) 352-MBGA (35x35)
Part Number Manufacturer Description Request For Quote
5SGXMA7H2F35C2WN Intel IC FPGA STRATIX V GX FLIP CHIP
5SGXMA7K2F40I3W Intel IC FPGA 696 I/O 1517FBGA
5SGXMA4H2F35C1WN Intel IC FPGA STRATIX V GX FLIP CHIP
5SGSMD5K3F40I4WN Intel IC FPGA STRATIX V GS FLIP CHIP
A54SX16-2TQ176 Microsemi IC FPGA 147 I/O 176TQFP
5SGXMA5K3F35C4WN Intel IC FPGA STRATIX V GX FLIP CHIP
XC4025E-4PG223I Xilinx IC FPGA 192 I/O 223CPGA
XC2V2000-5BF957I Xilinx IC FPGA 624 I/O 957FCBGA
5SGXMA5K3F40I4WN Intel IC FPGA STRATIX V GX FLIP CHIP
A3P600L-1FGG256 Microsemi IC FPGA 177 I/O 256FBGA
LFSCM3GA40EP1-6FC1152C Lattice Semiconductor IC FPGA 604 I/O 1152FCBGA
XC2V40-5FGG256C Xilinx IC FPGA 88 I/O 256FBGA
EP20K100EFC196-3 Intel IC FPGA 196BGA
A54SX16-PQ208 Microsemi IC FPGA 175 I/O 208QFP
XC2V2000-4BFG957I Xilinx IC FPGA 624 I/O 957FCBGA
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