XCV400E-6BG560C vs XCV400E-6BG560I

This detailed comparison of XCV400E-6BG560C and XCV400E-6BG560I in the Embedded - FPGAs (Field Programmable Gate Array) provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

XCV400E-6BG560C

XCV400E-6BG560C

Xilinx

XCV400E-6BG560I

XCV400E-6BG560I

Xilinx

Specifications
Manufacturer Xilinx Xilinx
Package / Case 560-LBGA Exposed Pad, Metal 560-LBGA Exposed Pad, Metal
Description IC FPGA 404 I/O 560MBGA IC FPGA 404 I/O 560MBGA
In Stock 714 706
Mounting Type Surface Mount Surface Mount
Part Status Obsolete Obsolete
Series Virtex®-E Virtex®-E
Package Tray Tray
Number of LABs/CLBs 2400 2400
Number of Logic Elements/Cells 10800 10800
Total RAM Bits 163840 163840
Number of I/O 404 404
Number of Gates 569952 569952
Voltage - Supply 1.71V ~ 1.89V 1.71V ~ 1.89V
Operating Temperature 0°C ~ 85°C (TJ) -40°C ~ 100°C (TJ)
Supplier Device Package 560-MBGA (42.5x42.5) 560-MBGA (42.5x42.5)
Part Number Manufacturer Description Request For Quote
XC2VP30-6FF896C Xilinx IC FPGA 556 I/O 896FCBGA
LFSC3GA25E-5FFA1020I Lattice Semiconductor IC FPGA 476 I/O 1020BGA
XCV400-4BG432C Xilinx IC FPGA 316 I/O 432MBGA
5SGXMA3K3F40C3NCV Intel IC FPGA STRATIX V GX FLIP CHIP
M1AFS250-1PQ208I Microsemi IC FPGA 93 I/O 208QFP
5SGXEA7K3F40I3WN Intel IC FPGA STRATIX V GX FLIP CHIP
XC2V500-4FGG256I Xilinx IC FPGA 172 I/O 256FBGA
A3P250-QNG132T Microsemi IC FPGA 87 I/O 132QFN
LFSC3GA80E-6FFN1704I Lattice Semiconductor IC FPGA 904 I/O 1704FCBGA
A14V60A-TQ176C Microsemi IC FPGA 151 I/O 176TQFP
A1440A-1PLG84I Microsemi IC FPGA 70 I/O 84PLCC
XCV2000E-7FG680C Xilinx IC FPGA 512 I/O 680FBGA
1SG280LU3F50E3XGS3 Intel IC FPGA STRATIX 10 2397FBGA
5SGSED8N2F46C3N Intel IC FPGA STRATIX V GS FLIP CHIP
A14V40A-PQG160C Microsemi IC FPGA 131 I/O 160QFP
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