XCV800-4BG560C vs XCV400-5BG560C

This detailed comparison of XCV800-4BG560C and XCV400-5BG560C in the Embedded - FPGAs (Field Programmable Gate Array) provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

XCV800-4BG560C

XCV800-4BG560C

Xilinx

XCV400-5BG560C

XCV400-5BG560C

VIGOR

Specifications
Manufacturer Xilinx VIGOR
Package / Case 560-LBGA Exposed Pad, Metal 560-LBGA Exposed Pad, Metal
Description IC FPGA 404 I/O 560MBGA FPGA, 2400 CLBS, 468252 GATES, 2
In Stock 387 355
Mounting Type Surface Mount Surface Mount
Part Status Obsolete Active
Series Virtex® Virtex®
Package Tray Bulk
Number of LABs/CLBs 4704 -
Number of Logic Elements/Cells 21168 -
Total RAM Bits 114688 -
Number of I/O 404 404
Number of Gates 888439 -
Voltage - Supply 2.375V ~ 2.625V 2.375V ~ 2.625V
Operating Temperature 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ)
Supplier Device Package 560-MBGA (42.5x42.5) 560-MBGA (42.5x42.5)
Part Number Manufacturer Description Request For Quote
A3P600L-FGG256 Microsemi IC FPGA 177 I/O 256FBGA
A1240A-1PLG84C Microsemi IC FPGA 72 I/O 84PLCC
EP20K400EB652C2XGZ Intel IC FPGA 488 I/O 652BGA
LFSC3GA25E-6FFAN1020C Lattice Semiconductor IC FPGA 476 I/O 1020BGA
XCV200-4BG352I Xilinx IC FPGA 260 I/O 352MBGA
5SGXMA5K3F35I3WN Intel IC FPGA STRATIX V GX FLIP CHIP
5SGXMA3K2F35C3WN Intel IC FPGA STRATIX V GX FLIP CHIP
LFX500EB-04F516I Lattice Semiconductor IC FPGA 336 I/O 516FBGA
5SGSMD4H3F35I4WN Intel IC FPGA STRATIX V GS FLIP CHIP
5SGXMA3K2F35I2WN Intel IC FPGA STRATIX V GX FLIP CHIP
OR2T15A6S208-DB Lattice Semiconductor IC FPGA 171 I/O 208QFP
XCV200-6PQ240C Xilinx IC FPGA 166 I/O 240QFP
AGL030V2-QNG132T Microsemi IC FPGA 81 I/O 132QFN
5SGXMA9K3H40I3NCV Intel IC FPGA STRATIX V GX FLIP CHIP
5SGXEA4H2F35C3NCV Intel IC FPGA STRATIX V GX FLIP CHIP
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