XE164F96F66LACFXQMA1 vs XE164F96F66LACFXUMA1

This detailed comparison of XE164F96F66LACFXQMA1 and XE164F96F66LACFXUMA1 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

XE164F96F66LACFXQMA1

IR (Infineon Technologies)

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XE164F96F66LACFXUMA1

IR (Infineon Technologies)

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Specifications Hide identical items

Manufacturer	IR (Infineon Technologies)	IR (Infineon Technologies)
Package / Case	100-LQFP Exposed Pad	100-LQFP Exposed Pad
Description	IC MCU 16BIT 768KB FLASH 100LQFP	IC MCU 16BIT 768KB FLASH 100LQFP
In Stock	1 700	8 750
Mounting Type	Surface Mount	Surface Mount
Part Status	Not For New Designs	Not For New Designs
Series	XE16x	XE16x
Package	Tray	Tape & Reel (TR)Cut Tape (CT)Digi-Reel®
Core Processor	C166SV2	C166SV2
Core Size	16-Bit	16-Bit
Speed	66MHz	66MHz
Connectivity	CANbus, EBI/EMI, I²C, LINbus, SPI, SSC, UART/USART, USI	CANbus, EBI/EMI, I²C, LINbus, SPI, SSC, UART/USART, USI
Peripherals	I²S, POR, PWM, WDT	I²S, POR, PWM, WDT
Number of I/O	75	75
Program Memory Size	768KB (768K x 8)	768KB (768K x 8)
Program Memory Type	FLASH	FLASH
EEPROM Size	-	-
RAM Size	82K x 8	82K x 8
Voltage - Supply (Vcc/Vdd)	3V ~ 5.5V	3V ~ 5.5V
Data Converters	A/D 16x10b	A/D 16x10b
Oscillator Type	Internal	Internal
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Supplier Device Package	PG-LQFP-100-3	PG-LQFP-100-3