XE216-256-FB236-C20 vs XEF216-256-FB236-C20

This detailed comparison of XE216-256-FB236-C20 and XEF216-256-FB236-C20 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

XE216-256-FB236-C20

XMOS

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XEF216-256-FB236-C20

XMOS

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Specifications Hide identical items

Manufacturer	XMOS	XMOS
Package / Case	236-LFBGA	236-LFBGA
Description	IC MCU 32BIT ROMLESS 236FBGA	IC MCU 32BIT 2MB FLASH 236FBGA
In Stock	1 950	1 875
Mounting Type	Surface Mount	Surface Mount
Part Status	Discontinued at Digi-Key	Discontinued at Digi-Key
Series	XE	XEF
Package	Tray	Tray
Core Processor	XCore	XCore
Core Size	32-Bit 16-Core	32-Bit 16-Core
Speed	2000MIPS	2000MIPS
Connectivity	RGMII, USB	RGMII, USB
Peripherals	-	-
Number of I/O	73	73
Program Memory Size	-	2MB (2M x 8)
Program Memory Type	ROMless	FLASH
EEPROM Size	-	-
RAM Size	256K x 8	256K x 8
Voltage - Supply (Vcc/Vdd)	0.95V ~ 3.6V	0.95V ~ 3.6V
Data Converters	-	-
Oscillator Type	External	External
Operating Temperature	0°C ~ 70°C (TA)	0°C ~ 70°C (TA)
Supplier Device Package	236-FBGA (10x10)	236-FBGA (10x10)