XLF224-512-FB374-C40 vs XL232-512-FB374-C40

This detailed comparison of XLF224-512-FB374-C40 and XL232-512-FB374-C40 in the Embedded - Microcontrollers provides valuable insights into their specifications and features. Key aspects such as Manufacturer, Package, Mounting Type, and core parameters are thoroughly analyzed. This side-by-side comparison simplifies component selection. To learn more, explore their datasheets or request a quote directly.

XLF224-512-FB374-C40

XLF224-512-FB374-C40

XMOS

XL232-512-FB374-C40

XL232-512-FB374-C40

XMOS

Specifications
Manufacturer XMOS XMOS
Package / Case 374-LFBGA 374-LFBGA
Description IC MCU 32BIT 2MB FLASH 374FBGA IC MCU 32BIT ROMLESS 374FBGA
In Stock 1 800 1 195
Mounting Type Surface Mount Surface Mount
Part Status Not For New Designs Active
Series XLF XL
Package Tray Tray
Core Processor XCore XCore
Core Size 32-Bit 24-Core 32-Bit 24-Core
Speed 4000MIPS 4000MIPS
Connectivity - -
Peripherals - -
Number of I/O 176 176
Program Memory Size 2MB (2M x 8) -
Program Memory Type FLASH ROMless
EEPROM Size - -
RAM Size 512K x 8 512K x 8
Voltage - Supply (Vcc/Vdd) 0.95V ~ 3.6V 0.95V ~ 3.6V
Data Converters - -
Oscillator Type External External
Operating Temperature 0°C ~ 70°C (TA) 0°C ~ 70°C (TA)
Supplier Device Package 374-FBGA (18x18) 374-FBGA (18x18)
Part Number Manufacturer Description Request For Quote
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UPD70F3769GF-GAT-AX Renesas Electronics America IC MCU 32BIT 512KB FLASH 100LQFP
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R5F1016DASP#10 Renesas Electronics America IC MCU 16BIT 48KB FLASH 20LSSOP
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MC9S08PA60AVLD NXP Semiconductors IC MCU 8BIT 60KB FLASH 44LQFP
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