Onsemi has recently announced the launch of a new cooling packaging technology designed to address the growing thermal challenges in high-power applications. Featuring an innovative top-side cooling (Top-Cool) package structure, the new solution significantly reduces thermal resistance and enables higher efficiency and reliability in next-generation power systems.
Tackling Thermal Bottlenecks in High-Power Designs
As demand increases across electric vehicles, charging infrastructure, renewable energy, and industrial power systems, conventional bottom-cooled packaging approaches are increasingly limiting overall system performance.
onsemi’s new packaging technology redirects the primary heat dissipation path to the top of the package, allowing heat to transfer more directly to external heat sinks. This design helps lower junction temperatures and improves long-term system stability.
Key Benefits: Lower Thermal Resistance, Higher Efficiency
The new cooling package delivers a lower junction-to-heatsink thermal resistance, offering several advantages:
- Improved energy efficiency through reduced thermal losses
- Higher power density enabling more compact system designs
- Enhanced reliability by maintaining stable operating temperatures
The technology is particularly well-suited for SiC (Silicon Carbide) power devices, supporting high-voltage and high-current applications where thermal performance is critical.
Designed for High-Demand Applications
According to onsemi, the new packaging solution targets key power-intensive markets, including:
- Electric vehicle traction inverters and onboard chargers
- DC fast-charging infrastructure
- Solar and energy storage inverters
- Industrial power supplies and energy management systems
In these applications, effective thermal management plays a decisive role in determining system efficiency, size, and overall cost.
Conclusion
As power electronics continue to evolve toward higher efficiency and greater power density, advanced packaging technologies are becoming just as important as semiconductor process innovations.
With this latest cooling packaging technology, onsemi provides system designers with a practical solution to thermal challenges while reinforcing its position in high-efficiency power semiconductor solutions.